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Ni-Te系统的扩散激活能和扩散系数研究
贾彦彦; 韩汾汾; 程宏伟; 李志军; 邹杨; 徐洪杰
2013-07-15
Source Publication上海金属
Issue4Pages:1-4+12
Abstract在Ni基底上电镀Te薄膜,然后在不同温度下对样品进行相同时间的真空热处理,经室温拉断后测得样品沿晶界断裂深度x。通过拟合ln(x2/t)与1/T的线性关系求出扩散激活能,得出中低温段Te在纯Ni中的晶界扩散系数,并对实验结果和计算进行了讨论。结果表明,在Ni表面镀Te条件下,随温度的升高,Ni的抗拉强度及延伸率急剧下降,试样断口上的沿晶断裂深度逐渐增大;计算得出Te沿纯Ni晶界扩散的激活能为152 kJ/mol,并得出在500℃到1 000℃之间的扩散系数表达式为:D=0.83×10-2exp(-18 360/T)cm2/s。
KeywordNi-te系 扩散深度 扩散激活能 扩散系数
Indexed ByCNKI
Language中文
Funding Project应物所项目组
Document Type期刊论文
Identifierhttp://ir.sinap.ac.cn/handle/331007/13443
Collection中科院上海应用物理研究所2011-2019年
Recommended Citation
GB/T 7714
贾彦彦,韩汾汾,程宏伟,等. Ni-Te系统的扩散激活能和扩散系数研究[J]. 上海金属,2013(4):1-4+12.
APA 贾彦彦,韩汾汾,程宏伟,李志军,邹杨,&徐洪杰.(2013).Ni-Te系统的扩散激活能和扩散系数研究.上海金属(4),1-4+12.
MLA 贾彦彦,et al."Ni-Te系统的扩散激活能和扩散系数研究".上海金属 .4(2013):1-4+12.
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