CAS OpenIR  > 中科院上海应用物理研究所2011-2019年
In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn-Cu solder alloys
Zhou, P; Kang, HJ; Cao, F; Fu, YA; Xiao, TQ; Wang, TM; tmwang@dlut.edu.cn
2014
Source PublicationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN0957-4522
Volume25Issue:10Pages:4538—4546
AbstractThe growth behavior of Cu6Sn5 intermetallic compounds in rare earth (RE)-doped Sn-Cu solder alloys with an applied direct current (DC) has been in situ investigated using synchrotron radiation imaging technology. The morphological evolutions of Cu6Sn5 with various shapes of I-like, Y-like and bird-like are directly observed. After doping RE, the number of I-like and bird-like Cu6Sn5 is decreased, but the number of Y-like Cu6Sn5 is increased. The morphologies of Cu6Sn5 are more uniform and the mean lengths of Cu6Sn5 of different shapes are reduced in RE-doped alloys compared with that in RE-free alloys, which is attributed to the adsorption effect of RE. The growth orientation of Y-like Cu6Sn5 is changed after La is doped. Additionally, with an applied DC, the nucleation rate of Cu6Sn5 is increased and the growth rate is markedly enhanced resulting in the refinement of Cu6Sn5. Furthermore, the mechanisms of refinement caused by RE and DC are specifically discussed.
KeywordLead-free Solder Rare-earth-elements Solid-liquid Interface Directional Solidification Electric-current Molten Sn Microstructure Joints Evolution Snagcu
Indexed BySCI
Language英语
WOS IDWOS:000342157500051
Citation statistics
Cited Times:13[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.sinap.ac.cn/handle/331007/14189
Collection中科院上海应用物理研究所2011-2019年
Corresponding Authortmwang@dlut.edu.cn
Recommended Citation
GB/T 7714
Zhou, P,Kang, HJ,Cao, F,et al. In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn-Cu solder alloys[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2014,25(10):4538—4546.
APA Zhou, P.,Kang, HJ.,Cao, F.,Fu, YA.,Xiao, TQ.,...&tmwang@dlut.edu.cn.(2014).In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn-Cu solder alloys.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,25(10),4538—4546.
MLA Zhou, P,et al."In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn-Cu solder alloys".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 25.10(2014):4538—4546.
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