CAS OpenIR  > 中科院上海应用物理研究所2011-2019年
Interface stress development in the Cu/Ag nanostructured multilayered film during the tensile deformation
Su, R; Li, L; Nie, ZH; Zhang, QH; Wang, YD; Zhou, XT; Wu, YD; Hui, XD; Li, XJ; Wang, MG; lili_ose@sinap.ac.cn; ydwang@mail.neu.edu.cn
2014
Source PublicationAPPLIED PHYSICS LETTERS
ISSN0003-6951
Volume105Issue:22
AbstractCu/Ag nanostructured multilayered films (NMFs) with different stacking sequences were investigated by synchrotron X-ray diffraction during the tensile deformations for interface stress study. The lattice strains were carefully traced and the stress partition, which usually occurs in the multiphase bulk metallic materials during plastic deformations, was first quantitatively analyzed in the NMFs here. The interface stress of the Cu/Ag NMFs was carefully analyzed during the tensile deformation and the results revealed that the interface stress was along the loading direction and exhibited three-stage evolution. This tensile interface stress has a detrimental effect on the deformation, leading to the early fracture of the NMFs. (c) 2014 AIP Publishing LLC.
KeywordX-ray-diffraction Metallic Multilayers Elastic-constants Ag/cu Multilayers Synchrotron Strength Cu Ag
Indexed BySCI
Language英语
WOS IDWOS:000346265200033
Citation statistics
Cited Times:2[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.sinap.ac.cn/handle/331007/14201
Collection中科院上海应用物理研究所2011-2019年
Corresponding Authorlili_ose@sinap.ac.cn; ydwang@mail.neu.edu.cn
Recommended Citation
GB/T 7714
Su, R,Li, L,Nie, ZH,et al. Interface stress development in the Cu/Ag nanostructured multilayered film during the tensile deformation[J]. APPLIED PHYSICS LETTERS,2014,105(22).
APA Su, R.,Li, L.,Nie, ZH.,Zhang, QH.,Wang, YD.,...&ydwang@mail.neu.edu.cn.(2014).Interface stress development in the Cu/Ag nanostructured multilayered film during the tensile deformation.APPLIED PHYSICS LETTERS,105(22).
MLA Su, R,et al."Interface stress development in the Cu/Ag nanostructured multilayered film during the tensile deformation".APPLIED PHYSICS LETTERS 105.22(2014).
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