CAS OpenIR  > 中科院上海应用物理研究所2011-2019年
Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography
Wang, TM; Cao, F; Zhou, P; Kang, HJ; Chen, ZN; Fu, YN; Xiao, TQ; Huang, WX; Yuan, QX; tmwang@dlut.edu.cn
2014
Source PublicationJOURNAL OF ALLOYS AND COMPOUNDS
ISSN0925-8388
Volume616Pages:550—555
AbstractSynchrotron X-ray radiography was used to in situ study the interface diffusion behavior and microstructural evolution during the melting and solidification of Al/Cu bimetal. During the solidification, the dendritic growth around the interface is mainly dominated by the variation of Cu concentration and thermal field. Four transition zones of solute profile around the interface were identified to be I (alpha-Al), II (Al + Al2Cu), III (Al2Cu) and IV (AlCu, Al3Cu4 and Al2Cu3), respectively. During the melting, the concentration variations of Al and Cu around the interface were quantitatively analyzed through the extraction of gray level from sequenced X-ray images. The diffusion coefficients of Cu in liquid Al were calculated from the known concentration variations by an inverse method based on Fick's second law. The diffusion coefficients of Cu in Al were found to follow linear Arrhenius equation dependencies with the pre-exponential factor of 2.83 x 10(-5) m(2) s(-1) and the activation energy of 96.0 kJ mol(-1) in a temperature range of 893-970 K. (C) 2014 Elsevier B.V. All rights reserved.
KeywordReal-time Observation In-situ Impurity Diffusion Growth-behavior Compound Layers Magnetic-field Al Diffusion Liquid Al Aluminum Cu
Indexed BySCI
Language英语
WOS IDWOS:000342654000082
Citation statistics
Document Type期刊论文
Identifierhttp://ir.sinap.ac.cn/handle/331007/14428
Collection中科院上海应用物理研究所2011-2019年
Corresponding Authortmwang@dlut.edu.cn
Recommended Citation
GB/T 7714
Wang, TM,Cao, F,Zhou, P,et al. Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2014,616:550—555.
APA Wang, TM.,Cao, F.,Zhou, P.,Kang, HJ.,Chen, ZN.,...&tmwang@dlut.edu.cn.(2014).Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography.JOURNAL OF ALLOYS AND COMPOUNDS,616,550—555.
MLA Wang, TM,et al."Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography".JOURNAL OF ALLOYS AND COMPOUNDS 616(2014):550—555.
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