CAS OpenIR  > 中科院上海应用物理研究所2011-2020年
Cooling for SC Devices of Test Cryomodule for ADS Injector II at IMP
Wang, L; Wang, SY; Sun, S; Guo, XL; Wang, SH; Liu, YY
Conference NameJoint Conference of the Transactions of the Cryogenic Engineering Conference (CEC) / Transactions of the International Cryogenic Materials Conference
Conference Date2013
Conference PlaceAnchorage, AK
AbstractThe superconducting half-wave resonance cavities connected in series with superconducting solenoids will be applied to the Injector II of the Accelerator Driven Sub-critical System (ADS) to be built at the Modern Physics Institute, China. A test system has been developed for the purpose of performance test of the HWR cavities as well as validating the relevant technique for cooling the cavity and the solenoids together. It mainly comprises a cryogenic valve box (TVB), a test cryomodule (TCM1) and transfer lines. The TCM1 includes one HWR cavity, two superconducting solenoids, one cold BPM and their cooling system. The design of the TCM1 cryostat was carried out by the Shanghai Institute of Applied Physics (SINAP), CAS. Both the cavity and the solenoids will work at 4.4 K by bath cooling. The fast cooling down for the cavity from around 100 K to 120 K is required to avoid degrading of the cavity performance. After cool down and before energization, the solenoids should be warmed up to above 10 K and re-cooled down for the purpose of degaussing. The TCM1 can not only be cooled by using the dewar-filling system, but also operated by the refrigerator system. For the purpose of reducing the heat loads to the cold mass at 4 K from room temperature, thermal radiation shields cooled by liquid nitrogen flowing in tubing were employed. This paper presents the design details of cooling circuits and thermal shields of the TCM1 as well as related calculations and analyses.
Indexed BySCI
Document Type会议论文
Recommended Citation
GB/T 7714
Wang, L,Wang, SY,Sun, S,et al. Cooling for SC Devices of Test Cryomodule for ADS Injector II at IMP[C]:AMER INST PHYSICS,2014:1333—1340.
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