CAS OpenIR  > 中科院上海应用物理研究所2011-2019年
Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation
Wang, TM; Zhou, P; Cao, F; Kang, HJ; Chen, ZN; Fu, YN; Xiao, TQ; Huang, WX; Yuan, QX
2015
Source PublicationINTERMETALLICS
Volume58Pages:84—90
Subtype期刊文献
AbstractHigh resolution time-resolved X-ray imaging with synchrotron radiation has been used to in situ observe the growth behavior of Cu6Sn5 intermetallic compounds (IMCs) during solidification in Sn-6.5 Cu and Sn-6.5 Cu-0.2 Al (wt. %) solders under applied direct current (DC) field. The morphological evolution of Cu6Sn5 with I-like, X-like, Y-like and bird-like shapes is directly observed. It is shown that trace levels of Al have a marked effect on the solder microstructures and refining the size of the primary Cu6Sn5. The solidification pathway leading to the refinement is observed in real time using synchrotron microradiography. After adding the trace Al, I-like shapes bifurcate into X-like shapes. Furthermore, when DC field with 10 A/cm(2) is applied, both the growth rate and the mean size of Cu6Sn5 are increased but decreased when 100 A/cm(2) is applied. Meanwhile, the effect of thermodynamic potential barrier caused by DC field on the growth behavior of Cu6Sn5 is discussed. (C) 2014 Elsevier Ltd. All rights reserved.
KeywordLead-free Solder Interfacial Reactions Imaging Technology Current-density Zn Addition Microstructure Alloys Ni Solidification Improvement
Indexed BySCI
Language英语
Document Type期刊论文
Identifierhttp://ir.sinap.ac.cn/handle/331007/24468
Collection中科院上海应用物理研究所2011-2019年
Recommended Citation
GB/T 7714
Wang, TM,Zhou, P,Cao, F,et al. Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation[J]. INTERMETALLICS,2015,58:84—90.
APA Wang, TM.,Zhou, P.,Cao, F.,Kang, HJ.,Chen, ZN.,...&Yuan, QX.(2015).Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation.INTERMETALLICS,58,84—90.
MLA Wang, TM,et al."Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation".INTERMETALLICS 58(2015):84—90.
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