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题名:
Molecular dynamics study of thermal transport across grain boundaries in silicon carbide nanorod
作者: Wang, H; Zhang, W; Wang, CB; Ma, JW; Huai, P
刊名: MATERIALS RESEARCH EXPRESS
出版日期: 2016
卷号: 3, 期号:3, 页码:
关键词: POLYCRYSTALLINE GRAPHENE ; FUEL-PARTICLES ; NANOWIRES ; CONDUCTIVITY ; RESISTANCE ; EBSD
DOI: 10.1088/2053-1591/3/3/035018
通讯作者: Huai, P (reprint author), Chinese Acad Sci, Shanghai Inst Appl Phys, Shanghai 201800, Peoples R China.
文章类型: 期刊文献
英文摘要: The thermal transport behaviors of < 011 > Sigma 3, Sigma 9 and Sigma 11 grain boundaries (GBs) in silicon carbide nanorod are investigated by using nonequilibrium molecular dynamics (NEMD) simulation. Temperature changes suddenly at the boundaries if a constant heat flux is assumed. The thermal conductance of these GBs is found several times larger than that of interfaces of other materials previously reported. Furthermore the interfacial thermal resistance increases with elevated temperature above 500 K. Our results give theoretical guidance to understand the underlying thermal transport mechanism in silicon carbide, and may be helpful to design silicon carbide materials for high temperature applications.
收录类别: SCI
语种: 英语
WOS记录号: WOS:000377811100019
ISSN号: 2053-1591
Citation statistics:
内容类型: 期刊论文
URI标识: http://ir.sinap.ac.cn/handle/331007/25775
Appears in Collections:中科院上海应用物理研究所2011-2017年_期刊论文

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Recommended Citation:
Wang, H,Zhang, W,Wang, CB,et al. Molecular dynamics study of thermal transport across grain boundaries in silicon carbide nanorod[J]. MATERIALS RESEARCH EXPRESS,2016-01-01,3(3):—.
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