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题名:
X-ray quantitative analysis on spallation response in high purity copper under sweeping detonation
作者: Yang, Y; Chen, JX; Peng, ZQ; Guo, ZL; Tang, TG; Hu, HB; Hu, YA
刊名: MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
出版日期: 2016
卷号: 667, 期号:-, 页码:54—60
关键词: TOMOGRAPHY ; ALUMINUM ; QUANTIFICATION ; BEHAVIOR ; FRACTURE ; FAILURE ; DAMAGE ; SIZE
DOI: 10.1016/j.msea.2016.04.090
通讯作者: Yang, Y (reprint author), Cent S Univ, Sch Mat Sci & Engn, Changsha 410083, Peoples R China.
文章类型: 期刊文献
英文摘要: The 3-D quantitative investigation of spall behavior in high purity copper plants with different heat treatment histories was characterized using X-ray computer tomography (XRCT). The effect of shock stress and grain size on the spatial distribution and morphology of incipient spall samples were discussed. The results revealed that, in samples with similar microstructure, the ranges of void distribution decrease with the increasing of shock stress. The characteristic parameters (such as mean elongation, mean flatness and mean sphericity of voids) determined using XRCT herein as a function of shock stress and grain size. The quantitative analyses of spallation datasets render functional relationships between the microscopic parameters (like volume, frequency) of spallation voids and the microstructure. The XRCT observations show that voids are prone to coalescence in thermo-mechanical treatments (TMT) sample, while the final maximum and mean volume of void were smaller than that of annealed sample. This is due to the smaller grain size of TMT sample, which means more nucleation sites of voids, this made the voids get closer and easier to coalescence, and flat voids formed ultimately. (C) 2016 Elsevier B.V. All rights reserved.
收录类别: SCI
语种: 英语
WOS记录号: WOS:000378183800006
ISSN号: 0921-5093
Citation statistics:
内容类型: 期刊论文
URI标识: http://ir.sinap.ac.cn/handle/331007/25895
Appears in Collections:中科院上海应用物理研究所2011-2017年_期刊论文

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Recommended Citation:
Yang, Y,Chen, JX,Peng, ZQ,et al. X-ray quantitative analysis on spallation response in high purity copper under sweeping detonation[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2016-01-01,667(-):54—60.
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