X-ray quantitative analysis on spallation response in high purity copper under sweeping detonation
Yang, Y; Chen, JX; Peng, ZQ; Guo, ZL; Tang, TG; Hu, HB; Hu, YA; Yang, Y (reprint author), Cent S Univ, Sch Mat Sci & Engn, Changsha 410083, Peoples R China.
2016
发表期刊MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN0921-5093
卷号667期号:-页码:54—60
文章类型期刊文献
摘要The 3-D quantitative investigation of spall behavior in high purity copper plants with different heat treatment histories was characterized using X-ray computer tomography (XRCT). The effect of shock stress and grain size on the spatial distribution and morphology of incipient spall samples were discussed. The results revealed that, in samples with similar microstructure, the ranges of void distribution decrease with the increasing of shock stress. The characteristic parameters (such as mean elongation, mean flatness and mean sphericity of voids) determined using XRCT herein as a function of shock stress and grain size. The quantitative analyses of spallation datasets render functional relationships between the microscopic parameters (like volume, frequency) of spallation voids and the microstructure. The XRCT observations show that voids are prone to coalescence in thermo-mechanical treatments (TMT) sample, while the final maximum and mean volume of void were smaller than that of annealed sample. This is due to the smaller grain size of TMT sample, which means more nucleation sites of voids, this made the voids get closer and easier to coalescence, and flat voids formed ultimately. (C) 2016 Elsevier B.V. All rights reserved.
关键词Tomography Aluminum Quantification Behavior Fracture Failure Damage Size
DOI10.1016/j.msea.2016.04.090
收录类别SCI
语种英语
WOS记录号WOS:000378183800006
引用统计
文献类型期刊论文
条目标识符http://ir.sinap.ac.cn/handle/331007/25895
专题中科院上海应用物理研究所2011-2018年
通讯作者Yang, Y (reprint author), Cent S Univ, Sch Mat Sci & Engn, Changsha 410083, Peoples R China.
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Yang, Y,Chen, JX,Peng, ZQ,et al. X-ray quantitative analysis on spallation response in high purity copper under sweeping detonation[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2016,667(-):54—60.
APA Yang, Y.,Chen, JX.,Peng, ZQ.,Guo, ZL.,Tang, TG.,...&Yang, Y .(2016).X-ray quantitative analysis on spallation response in high purity copper under sweeping detonation.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,667(-),54—60.
MLA Yang, Y,et al."X-ray quantitative analysis on spallation response in high purity copper under sweeping detonation".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 667.-(2016):54—60.
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