CAS OpenIR  > 中科院上海应用物理研究所2011-2018年
X-ray quantitative analysis on spallation response in high purity copper under sweeping detonation
Yang, Y; Chen, JX; Peng, ZQ; Guo, ZL; Tang, TG; Hu, HB; Hu, YA; Yang, Y (reprint author), Cent S Univ, Sch Mat Sci & Engn, Changsha 410083, Peoples R China.
2016
Source PublicationMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN0921-5093
Volume667Issue:-Pages:54—60
Subtype期刊文献
AbstractThe 3-D quantitative investigation of spall behavior in high purity copper plants with different heat treatment histories was characterized using X-ray computer tomography (XRCT). The effect of shock stress and grain size on the spatial distribution and morphology of incipient spall samples were discussed. The results revealed that, in samples with similar microstructure, the ranges of void distribution decrease with the increasing of shock stress. The characteristic parameters (such as mean elongation, mean flatness and mean sphericity of voids) determined using XRCT herein as a function of shock stress and grain size. The quantitative analyses of spallation datasets render functional relationships between the microscopic parameters (like volume, frequency) of spallation voids and the microstructure. The XRCT observations show that voids are prone to coalescence in thermo-mechanical treatments (TMT) sample, while the final maximum and mean volume of void were smaller than that of annealed sample. This is due to the smaller grain size of TMT sample, which means more nucleation sites of voids, this made the voids get closer and easier to coalescence, and flat voids formed ultimately. (C) 2016 Elsevier B.V. All rights reserved.
KeywordTomography Aluminum Quantification Behavior Fracture Failure Damage Size
DOI10.1016/j.msea.2016.04.090
Indexed BySCI
Language英语
WOS IDWOS:000378183800006
Citation statistics
Document Type期刊论文
Identifierhttp://ir.sinap.ac.cn/handle/331007/25895
Collection中科院上海应用物理研究所2011-2018年
Corresponding AuthorYang, Y (reprint author), Cent S Univ, Sch Mat Sci & Engn, Changsha 410083, Peoples R China.
Recommended Citation
GB/T 7714
Yang, Y,Chen, JX,Peng, ZQ,et al. X-ray quantitative analysis on spallation response in high purity copper under sweeping detonation[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2016,667(-):54—60.
APA Yang, Y.,Chen, JX.,Peng, ZQ.,Guo, ZL.,Tang, TG.,...&Yang, Y .(2016).X-ray quantitative analysis on spallation response in high purity copper under sweeping detonation.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,667(-),54—60.
MLA Yang, Y,et al."X-ray quantitative analysis on spallation response in high purity copper under sweeping detonation".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 667.-(2016):54—60.
Files in This Item:
File Name/Size DocType Version Access License
X-ray quantitative a(2295KB)期刊论文作者接受稿开放获取CC BY-NC-SAView Application Full Text
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Yang, Y]'s Articles
[Chen, JX]'s Articles
[Peng, ZQ]'s Articles
Baidu academic
Similar articles in Baidu academic
[Yang, Y]'s Articles
[Chen, JX]'s Articles
[Peng, ZQ]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Yang, Y]'s Articles
[Chen, JX]'s Articles
[Peng, ZQ]'s Articles
Terms of Use
No data!
Social Bookmark/Share
File name: X-ray quantitative analysis on spallation response in high purity copper under sweeping detonation.pdf
Format: Adobe PDF
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.