X-ray quantitative analysis on spallation response in high purity copper under sweeping detonation

doi:10.1016/j.msea.2016.04.090

CAS OpenIR > 中科院上海应用物理研究所2011-2018年

	X-ray quantitative analysis on spallation response in high purity copper under sweeping detonation
	Yang, Y; Chen, JX; Peng, ZQ; Guo, ZL; Tang, TG; Hu, HB; Hu, YA; Yang, Y (reprint author), Cent S Univ, Sch Mat Sci & Engn, Changsha 410083, Peoples R China.
	2016
发表期刊	MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN	0921-5093
卷号	667 期号:-页码:54—60
文章类型	期刊文献
摘要	The 3-D quantitative investigation of spall behavior in high purity copper plants with different heat treatment histories was characterized using X-ray computer tomography (XRCT). The effect of shock stress and grain size on the spatial distribution and morphology of incipient spall samples were discussed. The results revealed that, in samples with similar microstructure, the ranges of void distribution decrease with the increasing of shock stress. The characteristic parameters (such as mean elongation, mean flatness and mean sphericity of voids) determined using XRCT herein as a function of shock stress and grain size. The quantitative analyses of spallation datasets render functional relationships between the microscopic parameters (like volume, frequency) of spallation voids and the microstructure. The XRCT observations show that voids are prone to coalescence in thermo-mechanical treatments (TMT) sample, while the final maximum and mean volume of void were smaller than that of annealed sample. This is due to the smaller grain size of TMT sample, which means more nucleation sites of voids, this made the voids get closer and easier to coalescence, and flat voids formed ultimately. (C) 2016 Elsevier B.V. All rights reserved.
关键词	Tomography Aluminum Quantification Behavior Fracture Failure Damage Size
DOI	10.1016/j.msea.2016.04.090
收录类别	SCI
语种	英语
WOS记录号	WOS:000378183800006
引用统计
文献类型	期刊论文
条目标识符	http://ir.sinap.ac.cn/handle/331007/25895
专题	中科院上海应用物理研究所2011-2018年
通讯作者	Yang, Y (reprint author), Cent S Univ, Sch Mat Sci & Engn, Changsha 410083, Peoples R China.
推荐引用方式 GB/T 7714	Yang, Y,Chen, JX,Peng, ZQ,et al. X-ray quantitative analysis on spallation response in high purity copper under sweeping detonation[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2016,667(-):54—60.
APA	Yang, Y.,Chen, JX.,Peng, ZQ.,Guo, ZL.,Tang, TG.,...&Yang, Y .(2016).X-ray quantitative analysis on spallation response in high purity copper under sweeping detonation.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,667(-),54—60.
MLA	Yang, Y,et al."X-ray quantitative analysis on spallation response in high purity copper under sweeping detonation".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 667.-(2016):54—60.

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