A novel heating area design of temperature-jump microfluidic chip for synchrotron radiation solution X-ray scattering
Li, YW; Bian, FG; Wang, J; Wang, J (reprint author), Chinese Acad Sci, Shanghai Inst Appl Phys, Zhangjiang Campus, Shanghai 201204, Peoples R China.
2016
发表期刊NUCLEAR SCIENCE AND TECHNIQUES
ISSN1001-8042
卷号27期号:4页码:-
文章类型期刊论文
摘要In this paper, we present a novel design scheme of temperature-jump (T-jump) area for microfluidic device. Numerical simulation and experimental research of thermal characteristics of the solution in microchannels is completed. Numerical simulation of the temperature-jump microchannel is analyzed to study the heat transfer characteristics by comparing performance of three proposed configurations. Calculation of the power requirement is discussed in the dimensional design of microheater. Temperature-sensitive fluorescent dye is applied to investigate the temperature field of microchannel heated by a designed microheater. It is found that the T-jump microfluidic device can provide rapid heating for solutions with strong convection heat transfer ability.
关键词Synchrotron Radiation Solution X-ray Scattering Microfluidic Chip Temperature-jump
DOI10.1007/s41365-016-0083-9
收录类别SCI
语种英语
WOS记录号WOS:000385041100016
引用统计
文献类型期刊论文
条目标识符http://ir.sinap.ac.cn/handle/331007/26411
专题中科院上海应用物理研究所2011-2018年
通讯作者Bian, FG; Wang, J (reprint author), Chinese Acad Sci, Shanghai Inst Appl Phys, Zhangjiang Campus, Shanghai 201204, Peoples R China.
推荐引用方式
GB/T 7714
Li, YW,Bian, FG,Wang, J,et al. A novel heating area design of temperature-jump microfluidic chip for synchrotron radiation solution X-ray scattering[J]. NUCLEAR SCIENCE AND TECHNIQUES,2016,27(4):-.
APA Li, YW,Bian, FG,Wang, J,&Wang, J .(2016).A novel heating area design of temperature-jump microfluidic chip for synchrotron radiation solution X-ray scattering.NUCLEAR SCIENCE AND TECHNIQUES,27(4),-.
MLA Li, YW,et al."A novel heating area design of temperature-jump microfluidic chip for synchrotron radiation solution X-ray scattering".NUCLEAR SCIENCE AND TECHNIQUES 27.4(2016):-.
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