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N-Modified NiO Surface for Superior Alkaline Hydrogen Evolution 期刊论文
CHEMSUSCHEM, 2018, 卷号: 11, 期号: 6, 页码: 1020-1024
Authors:  Zhang, L;  Liu, PF;  Li, YH;  Zu, MY;  Li, X;  Jiang, Z;  Wang, Y;  Zhao, HJ;  Yang, HG
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Oxygen Evolution  Cobalt Oxide  Efficient  Nickel  Nanosheet  Electrocatalysts  Dissociation  Performance  Adsorption  Nanowires  
Improving the tensile ductility of metal matrix composites by laminated structure: A coupled X-ray tomography and digital image correlation study 期刊论文
SCRIPTA MATERIALIA, 2017, 卷号: 135, 期号: -, 页码: 63-67
Authors:  Fan, GH;  Geng, L;  Wu, H;  Miao, KS;  Cui, XP;  Kang, HJ;  Wang, TM;  Xie, HL;  Xiao, TQ
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Plasticity  Strength  Deformation  Fatigue  Steel  
Grain nucleation and growth behavior of a Sn-Pb alloy affected by direct current: An in situ investigation 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2017, 卷号: 33, 期号: 10, 页码: 1134-1140
Authors:  Yang, FF;  Chen, ZN;  Cao, F;  Fan, R;  Kang, HJ;  Huang, WX;  Yuan, QX;  Xiao, TQ;  Fu, YN;  Wang, TM
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Pulsed Magnetic-field  X-ray Radiography  Synchrotron Microradiography  Heterogeneous Nucleation  Immiscible Alloys  Electric-currents  Equiaxed Grains  Pure Aluminum  A356 Alloy  Solidification  
Effect of traveling magnetic field on solute distribution and dendritic growth in unidirectionally solidifying Sn-50 wt%Pb alloy: An in situ observation 期刊论文
JOURNAL OF CRYSTAL GROWTH, 2016, 卷号: 450, 页码: 91-95
Authors:  Cao, F;  Yang, FF;  Kang, HJ;  Zou, CL;  Xiao, TQ;  Huang, WX;  Wang, TM;  Wang, TM (reprint author), Dalian Univ Technol, Key Lab Solidificat Control & Digital Preparat Te, Sch Mat Sci & Engn, Dalian 116024, Peoples R China.
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Directional Solidification  Convection  Traveling Magnetic Field  Synchrotron X-ray Radiography  Dendritic Growth  Sn-pb Alloy  
Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation 期刊论文
INTERMETALLICS, 2015, 卷号: 58, 页码: 84—90
Authors:  Wang, TM;  Zhou, P;  Cao, F;  Kang, HJ;  Chen, ZN;  Fu, YN;  Xiao, TQ;  Huang, WX;  Yuan, QX
View  |  Adobe PDF(2931Kb)  |  Favorite  |  View/Download：128/10  |  Submit date：2015/12/09
Lead-free Solder  Interfacial Reactions  Imaging Technology  Current-density  Zn Addition  Microstructure  Alloys  Ni  Solidification  Improvement  
Three dimensional microstructures and wear resistance of Al-Bi immiscible alloys with different grain refiners 期刊论文
SCIENCE CHINA-TECHNOLOGICAL SCIENCES, 2015, 卷号: 58, 期号: 5, 页码: 870—875
Authors:  Wang, TM;  Cao, F;  Chen, ZN;  Kang, HJ;  Zhu, J;  Fu, YN;  Xiao, TQ;  Li, TJ
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Mechanical-properties  Cu Alloy  In-situ  Dendritic Microstructures  Master Alloy  Behavior  Solidification  Aluminum  Evolution  Microtomography  
Electrochemical study of the corrosion of a Ni-based alloy GH3535 in molten (Li,Na,K)F at 700 degrees C 期刊论文
JOURNAL OF FLUORINE CHEMISTRY, 2015, 卷号: 178, 页码: 14—22
Authors:  Wang, YL;  Liu, HJ;  Yu, GJ;  Hou, J;  Zeng, CL;  Zeng, CL (reprint author), Chinese Acad Sci, Lab Corros & Protect, Inst Met Res, 62 Wencui Rd, Shenyang 110016, Peoples R China.
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Fluoride Salt  Chromium  Flinak  
Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2014, 卷号: 616, 页码: 550—555
Authors:  Wang, TM;  Cao, F;  Zhou, P;  Kang, HJ;  Chen, ZN;  Fu, YN;  Xiao, TQ;  Huang, WX;  Yuan, QX;  tmwang@dlut.edu.cn
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Real-time Observation  In-situ  Impurity Diffusion  Growth-behavior  Compound Layers  Magnetic-field  Al Diffusion  Liquid Al  Aluminum  Cu  
In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn-Cu solder alloys 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 卷号: 25, 期号: 10, 页码: 4538—4546
Authors:  Zhou, P;  Kang, HJ;  Cao, F;  Fu, YA;  Xiao, TQ;  Wang, TM;  tmwang@dlut.edu.cn
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Lead-free Solder  Rare-earth-elements  Solid-liquid Interface  Directional Solidification  Electric-current  Molten Sn  Microstructure  Joints  Evolution  Snagcu  
In situ synchrotron X-ray imaging on morphological evolution of dendrites in Sn-Bi hypoeutectic alloy under electric currents 期刊论文
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2014, 卷号: 117, 期号: 3, 页码: 1059—1066
Authors:  Wang, TM;  Zhu, J;  Kang, HJ;  Chen, ZN;  Fu, YN;  Huang, WX;  Xiao, TQ;  tmwang@dlut.edu.cn
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To-equiaxed Transition  Al-cu Alloys  Directional Solidification  Magnetic-field  Current Pulse  Electrohydrodynamic Instability  Conductivity Gradient  Pure Aluminum  Fluid Layer  Growth