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Improving the tensile ductility of metal matrix composites by laminated structure: A coupled X-ray tomography and digital image correlation study 期刊论文
SCRIPTA MATERIALIA, 2017, 卷号: 135, 期号: -, 页码: 63-67
Authors:  Fan, GH;  Geng, L;  Wu, H;  Miao, KS;  Cui, XP;  Kang, HJ;  Wang, TM;  Xie, HL;  Xiao, TQ
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Plasticity  Strength  Deformation  Fatigue  Steel  
Grain nucleation and growth behavior of a Sn-Pb alloy affected by direct current: An in situ investigation 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2017, 卷号: 33, 期号: 10, 页码: 1134-1140
Authors:  Yang, FF;  Chen, ZN;  Cao, F;  Fan, R;  Kang, HJ;  Huang, WX;  Yuan, QX;  Xiao, TQ;  Fu, YN;  Wang, TM
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Pulsed Magnetic-field  X-ray Radiography  Synchrotron Microradiography  Heterogeneous Nucleation  Immiscible Alloys  Electric-currents  Equiaxed Grains  Pure Aluminum  A356 Alloy  Solidification  
Effect of traveling magnetic field on solute distribution and dendritic growth in unidirectionally solidifying Sn-50 wt%Pb alloy: An in situ observation 期刊论文
JOURNAL OF CRYSTAL GROWTH, 2016, 卷号: 450, 页码: 91-95
Authors:  Cao, F;  Yang, FF;  Kang, HJ;  Zou, CL;  Xiao, TQ;  Huang, WX;  Wang, TM;  Wang, TM (reprint author), Dalian Univ Technol, Key Lab Solidificat Control & Digital Preparat Te, Sch Mat Sci & Engn, Dalian 116024, Peoples R China.
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Directional Solidification  Convection  Traveling Magnetic Field  Synchrotron X-ray Radiography  Dendritic Growth  Sn-pb Alloy  
Effect of direct current pulses on mechanical and electrical properties of aged Cu-Cr-Zr alloys 期刊论文
MATERIALS & DESIGN, 2016, 卷号: 92, 期号: -, 页码: 135—142
Authors:  Wang, W;  Li, RG;  Zou, CL;  Chen, ZN;  Wen, W;  Wang, TM;  Yin, GM;  Wang, TM (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Key Lab Solidificat Control & Digital Preparat Te, 2 Linggong Rd, Dalian 116024, Liaoning, Peoples R China.
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Severe Plastic-deformation  Thermomechanical Treatment  Contact Wire  Microstructure  Precipitation  Strength  Behavior  Recrystallization  Metals  Copper  
Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation 期刊论文
INTERMETALLICS, 2015, 卷号: 58, 页码: 84—90
Authors:  Wang, TM;  Zhou, P;  Cao, F;  Kang, HJ;  Chen, ZN;  Fu, YN;  Xiao, TQ;  Huang, WX;  Yuan, QX
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Lead-free Solder  Interfacial Reactions  Imaging Technology  Current-density  Zn Addition  Microstructure  Alloys  Ni  Solidification  Improvement  
Real time investigation of the grain refinement dynamics in zinc alloy by synchrotron microradiography 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2015, 卷号: 630, 页码: 60—67
Authors:  Chen, F;  Mao, F;  Xuan, ZJ;  Yan, GY;  Han, JY;  Wang, TM;  Cao, ZQ;  Fu, YA;  Xiao, TQ
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Directional Solidification  Al-cu  Tib2 Particles  Aluminum  Growth  Composite  Microstructure  Fragmentation  Behavior  Za27  
Three dimensional microstructures and wear resistance of Al-Bi immiscible alloys with different grain refiners 期刊论文
SCIENCE CHINA-TECHNOLOGICAL SCIENCES, 2015, 卷号: 58, 期号: 5, 页码: 870—875
Authors:  Wang, TM;  Cao, F;  Chen, ZN;  Kang, HJ;  Zhu, J;  Fu, YN;  Xiao, TQ;  Li, TJ
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Mechanical-properties  Cu Alloy  In-situ  Dendritic Microstructures  Master Alloy  Behavior  Solidification  Aluminum  Evolution  Microtomography  
Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2014, 卷号: 616, 页码: 550—555
Authors:  Wang, TM;  Cao, F;  Zhou, P;  Kang, HJ;  Chen, ZN;  Fu, YN;  Xiao, TQ;  Huang, WX;  Yuan, QX;
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Real-time Observation  In-situ  Impurity Diffusion  Growth-behavior  Compound Layers  Magnetic-field  Al Diffusion  Liquid Al  Aluminum  Cu  
In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn-Cu solder alloys 期刊论文
Authors:  Zhou, P;  Kang, HJ;  Cao, F;  Fu, YA;  Xiao, TQ;  Wang, TM;
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Lead-free Solder  Rare-earth-elements  Solid-liquid Interface  Directional Solidification  Electric-current  Molten Sn  Microstructure  Joints  Evolution  Snagcu  
In situ synchrotron X-ray imaging on morphological evolution of dendrites in Sn-Bi hypoeutectic alloy under electric currents 期刊论文
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2014, 卷号: 117, 期号: 3, 页码: 1059—1066
Authors:  Wang, TM;  Zhu, J;  Kang, HJ;  Chen, ZN;  Fu, YN;  Huang, WX;  Xiao, TQ;
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To-equiaxed Transition  Al-cu Alloys  Directional Solidification  Magnetic-field  Current Pulse  Electrohydrodynamic Instability  Conductivity Gradient  Pure Aluminum  Fluid Layer  Growth