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Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation 期刊论文
INTERMETALLICS, 2015, 卷号: 58, 页码: 84—90
Authors:  Wang, TM;  Zhou, P;  Cao, F;  Kang, HJ;  Chen, ZN;  Fu, YN;  Xiao, TQ;  Huang, WX;  Yuan, QX
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Lead-free Solder  Interfacial Reactions  Imaging Technology  Current-density  Zn Addition  Microstructure  Alloys  Ni  Solidification  Improvement